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| Micro SD card connector push push,H1.85mm,with CD pin Material: Insulator:High Temperature Thermoplastic,LCP,UL94V-0. Contact:Copper Alloy T=0.15,Plated 50u" Ni Overall. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell:T=0.15,Plated 30u" Ni Overall min. Plated 0.5u" Au Selective ContactArea Electrical: Current Rating:0.5mA amx. Voltage Rating:3.3V Ambient Humidity Range:95% R.H. Max. Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min./500VDC Mating Cycles:5000 Insertions. Operating Temperature: -45ºC~+105ºC |
| Part No. | Description | PCS/CTN | G.W.(KG) | CMB(m3) | OrderQty. | Time | Order |