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| SIM Card Connector,PUSH PUSH,8P+1P,H1.9mm,with Post Material: Housing:Hi-Temp Plastic,UL94V-0.Rated. Contact:Copper Alloy. Shell:Copper Alloy. Plating: Contact Area:Gold flash. Solder area:80u" Min,Matte tin alloy plated. Under plate:30u" min,Nickel. Shell:30u" Min,Nickel plated overall Solder area:Gole flash. Electrical: Current Rating:0.5A. Withstanding Voltage:AC500V r.m.s. Insulation Resistance:1000MΩMin,At DC 500V Contact Resistance:100mΩ Max. Mating Cycles:3000 Insertions. Operating Temperature: -45ºC~+85ºC |
| Part No. | Description | PCS/CTN | G.W.(KG) | CMB(m3) | OrderQty. | Time | Order |