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| Micro SIM Card Connector 8P,PUSH PULL,H2.4mm Material: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Data Contact:Copper Alloy,Gold Plated. Shell:Stainless Steel,Gold Plated. Electrical: Contact Resistance:50mΩ typical,100Ω Max. Insulation Resistance:>1000MΩ/500V DC. 3.Solderability Vapor phase:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Manual soldering:370ºC.3sec.Max. Operating Temperature: -45ºC~+105ºC |
| Part No. | Description | PCS/CTN | G.W.(KG) | CMB(m3) | OrderQty. | Time | Order |