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SIM Card Connector,PUSH PUSH,6P+2P,H2.25mm,without Post Material: Housing:Hi-Temp Plastic,UL94V-0.Rated. Contact:Copper Alloy. Shell:Stainless Steel.SUS 301,T=0.20mm. Plating: Contact area:G/F Plated over 30u" Nickel Solder area:80u" Tin Plated over 30u" Nickel.Under plate:30u" Min Nickel. Shell:30u" Min,Nickel Plated Over All,SolderArea:Gold Flash. Electrical: Current Rating:0.5 A Dielectric Withstanding Voltage:250V AC/DC. Insulation Resistance:500MΩ Min. Contact Resistance:100mΩ Max. Mating Cycles:5000 Insertions. Operating Temperature: -45ºC~+85ºC |
Part No. | Description | PCS/CTN | G.W.(KG) | CMB(m3) | OrderQty. | Time | Order |