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| SIM Card Connector,PUSH PUSH,8P+1P,H1.85mm,without Post Material: Housing:High Temperature Thermoplastic,UL94V-0.Black. Contact:Copper Alloy. Cover:Contact:Copper Alloys Or Steel. Plating: Underplate:Nickel. Contact Area:Gold Over Nickel. Solder Area:Tin Over Nickel. Shell:G/F Plate Over Nickel On Solder Tails Electrical: Current Rating:0.5A. Voltage Rating:5.0 Vrms. Insulation Resistance:500M Min.At DC 500V DC Withstanding Voltage:250V ACrms For 1 Minute. Contact Resistance:100M Max.At 10MA/20mVMAX. Operating Temperature: -45ºC~+85ºC Mating Cycles:5000 Insertions. |
| Part No. | Description | PCS/CTN | G.W.(KG) | CMB(m3) | OrderQty. | Time | Order |